Download e-book for iPad: Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson

By James J. Licari,Dale W. Swanson

This ebook is exclusive in its complete insurance of all elements of adhesive know-how for microelectronic units and packaging, from concept to bonding to check techniques. as well as basic functions, corresponding to dies, substrate, and lid and chip stack attachments, the ebook comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. fast curing tools similar to UV, microwave, and moisture (which agree to present environmental and effort requisites) are lined. Over eighty tables and one hundred twenty figures offer a wealth of knowledge on homes, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. each one bankruptcy offers complete references.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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